HSS-C52-NP-SMT-TR
CUI Devices
HSS-C52-NP-SMT-TR
CUI Devices
HEAT SINK TO-252 COPPER
Reference Price (USD)
1+
$0.58297
500+
$0.5771403
1000+
$0.5713106
1500+
$0.5654809
2000+
$0.5596512
2500+
$0.5538215
Exquisite packaging
Discount
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Product details
Product Attributes
- product status: Active
- type: Top Mount
- package cooled: TO-252 (DPak)
- attachment method: -
- shape: Rectangular, Fins
- length: 0.315" (8.00mm)
- width: 0.900" (22.86mm)
- diameter: -
- fin height: 0.400" (10.16mm)
- power dissipation @ temperature rise: 2.1W @ 75°C
- thermal resistance @ forced air flow: 10.05°C/W @ 200 LFM
- thermal resistance @ natural: 35.71°C/W
- material: Copper
- material finish: Tin